李祥宇是 Ansys 台灣總經理，李祥宇於 2018 年加入 Ansys。具有 25 年的銷售和管理經驗。在全球領先的資訊科技公司中擔任總經理和銷售總監職務。業務範圍包含商用應用軟體，諮詢服務，計算機硬體和製造設備，業務區域涵蓋大中華和東南亞地區。

在加入 Ansys 前，他曾於美商 JDA Software 擔任大中華區的經理，美商惠普科技公司擔任副總經理及於美商甲骨文公司擔任業務總監。李祥宇擁有中原大學工業工程學士學位。

Dave Firth, With nearly thirteen years of tenure with Ansys and twenty years of experience in numerical analysis, Anthony Dawson has dedicated his career to simulation. Currently, the Vice President of Ansys Customer Excellence (ACE), Anthony leads Ansys’ global engineering teams. The mission for ACE is clear—make Ansys customers successful. Today, Anthony shares one of the latest innovations from ACE, AnsysGPT- an AI-powered virtual support engineer. Built using ChatGPT technology on an Open AI Microsoft Azure platform, fusing the expertise of accredited Ansys engineers with the dynamism of artificial intelligence and machine learning to deliver a general-use tool capable of providing rapid customer support. AnsysGPT empowers customers to independently find solutions to questions, enhancing the ACE support offerings. Through hands-on customer partnership and cutting-edge technological solutions, ACE is committed to scaling and influencing global innovation while tailoring Ansys technology to better serve customers in 2024 and beyond.

Dr. Christophe Bianchi is Chief Technologist at Ansys, the world leader in digital simulation software.
Graduated with a Master of Science and a Doctorate in electronics, as well as an MBA in economics and entrepreneurship from Imperial College, Christophe Bianchi combines technical and business acumen that led him to hold multiple management positions within international software companies along is 35+ year-long career.
Christophe Bianchi joined Ansys in 2019 with the mission of strengthening Ansys' presence and pursuing its strategic development in the European market. To achieve this, he works closely with a team distributed across the continent and coordinates cross-functional projects.
Beyond his human, technical and business capabilities, Christophe is driven by the desire to unite the ecosystem of Ansys customers, partners and employees around common passions: technology and innovation.

Norman Chang(張鴻嘉) 共同創辦了Apache Design Solutions公司，成立於2001年2月，並目前擔任Ansys電子、半導體和光學業務部門的Ansys資深專家和首席技術專家。他還領導著Ansys的人工智慧/機器學習和安全倡議。張博士在加利福尼亞大學伯克利分校獲得電氣工程和計算機科學博士學位。他持有25項專利，並與他人合著了60多篇技術論文，以及一本在2000年由Wiley-Interscience出版的暢銷書《Interconnect Analysis and Synthesis》。他還是EDPS、ESDA-EDA和SI2 AI/ML SIG委員會的成員，並且為IEEE院士。​ ​

Norman Chang(張鴻嘉) 共同創辦了Apache Design Solutions公司，成立於2001年2月，並目前擔任Ansys電子、半導體和光學業務部門的Ansys資深專家和首席技術專家。他還領導著Ansys的人工智慧/機器學習和安全倡議。張博士在加利福尼亞大學伯克利分校獲得電氣工程和計算機科學博士學位。他持有25項專利，並與他人合著了60多篇技術論文，以及一本在2000年由Wiley-Interscience出版的暢銷書《Interconnect Analysis and Synthesis》。他還是EDPS、ESDA-EDA和SI2 AI/ML SIG委員會的成員，並且為IEEE院士。​ ​

Jim DeLap 是 Ansys 的資深產品管理總監，負責與客戶和我們的工程團隊合作，為電子、半導體、光學和自主技術等產品提供最優質的模擬工作流程。在加入 Ansys 之前，他參與了從 DC 直流到紅外線頻率的電子產品設計，並在微波和信號完整性領域工作了將近 30 年。他是 IEEE、Eta Kappa Nu 和 Tau Beta Pi 的成員。

Senior Director Product Management
Jim DeLap is Senior Director of Product Management for Ansys working with customers and our engineering teams to provide the highest quality simulation workflow for Electronics, Semiconductor, Optical! And Autonomy products. Prior to Ansys, he has been involved in electronic product designs ranging in frequency from DC to infrared, and has been working in the microwave and signal integrity field for almost 30 years. He is a member of IEEE, Eta Kappa Nu, and Tau Beta Pi.

Integrating a wider range of device types by adopting heterogeneous integration technology enable increasingly important system level integration for data-driven era(AI application). “AI on Chip” is considered as a core element of every advanced smart system in the future. The presentation is to share the key aspects of “AI-on-Chip Program” in Taiwan as well as the achievement and Special-Interests Groups (SIGs) of AI-on-Chip Taiwan Alliance (AITA). AI-on-Chip program keeps the momentum to speed up the market-oriented research and development to fulfill the domain-specific needs of smart living, quality of life and sustainable environment by adopting both innovative Silicon IP and advanced heterogeneous integration technology. It includes “AI Chip Application”, “Heterogeneous AI Chip Integration”(Wafer-Level Chiplets Integration), “Emerging AI Processing Architecture” and “AI System Software” technologies. All these results will be further leverage Taiwan’s strength of semiconductor and ICT societies and continue to contribute to the world with its advances in AI Technologies.

2022年12月，ChatGPT發布，一夕之間，生成式AI, 大型語言模型(LLM)等關鍵字迅速蔓延整個市場。而ChatGPT的成功，絕對離不開背後強大的AI伺服器，也就是風靡台灣與全球的皮衣男-黃仁勳先生所帶領的NVIDIA AI解決方案。在這波AI風潮下，台灣在AI硬體上，尤其是伺服器上扮演著關鍵角色，有發展機遇，但也免不了有挑戰。只要能掌握機會，迎接挑戰，便能持續保持關鍵領先地位。

在先進製程的推進，晶片設計的Power Integrity Sign-off條件漸趨挑戰，如何縮短驗證流程並提早預防可能的Hot spot是一大重點。我們將分享SMI採用Redhawk-SC Sigma DVD在實際案例中的經驗。

Traditional Chip Power Model(CPM) is target for Package/PCB designer to design/sign-off SystemPI. However, in this talk, we would introduce how to use CPM to design on-chip PDN for high-speed interface.

利用ParagonX API PyCKT開發實用的批次處理工具，並彙整成可讀性佳的報表, 提供使用者能快速從數據中察覺優先檢視項目，進而實現電路廣泛檢查的目標。

在半導體領域中，AI 能夠有一個快速收斂的方式，使 power planning 得到最佳設計方案，有助於讓設計人員不浪費過多時間去調整或重做，並且符合專案設計上的需求。

This speech talks on 2.5D/3D-IC high speed integrated design solution and trend, where chiplets integration through advanced packaging technology has been critical demand in 5G/AI/HPC applications. With chiplets integration, high speed interface and signal/power/thermal integrity (SI/PI/TI) have been imperative from early-phase, design-phase, to sign-off-phase. GUC has solid SI/PI/TI design capability at high speed integrated designs, as well as with mature high speed key IPs solution (UCIe/HBM3) for chiplets integration. This speech not only introduces GUC high speed key IPs design solution, but also SI/PI/TI integrated design approaches, which can be benefits for product development, as well as design success with ANSYS powerful EDA solution. The agenda of presentation is, as follows,
1) Introduction of GUC ASIC design service
2) 2.5D/3D-IC integrated design flow & methodology
3) SI/PI/TI Enablement through ANSYS EDA solution
4) High speed key IPs integrated design examples
5) Summary

This topic demonstrates a magnetoelectric antenna-in-package using low-cost BT based substrate technology in D-band. In order to reduce the loss, optiSLang is used to optimize the tapper which is between probe and feeding network.

This work discusses the performance from Millimeter-Wave Antenna in package (mmWave AiP) with test socket. This work provides AiP designers to easily evaluate and optimize the electrical performance of AiP. The proposed broadband dual-polarized antenna array designed on the multi-layer organic substrates with size of 13 x 13 x 0.87 mm3. The proposed AiP with test socket has better than 10 dB return loss in 24.5-29.5 GHz range, with 5 GHz bandwidth and provides a high-gain (above ~11 dBi) radiation pattern for 5G mmWave beamforming application.

使聽眾能大概了解適用於超大規模資料中心的800G交換器設計以及其對現在AI/ML世代的影響性為何

矽光子的到來，將可進一步滿足高算力的需求，然而矽光子從廣泛到狹義的定義略有差異，各面臨到什麼樣的技術挑戰，趨勢上有可能的解法是什麼，讓我們來一窺究竟！

隨技術的發展，電源的設計餘裕度越來越低，而電源品質又影響系統穩定度。故如何快速且全面地確認電源設計品質是一大挑戰。本次研討會將介紹如何利用PyAEDT消除繁瑣的手動模擬設定過程，實現模擬流程的高效自動化。我們透過PyAEDT將ANSYS HFSS 3D Layout及Circuit Designer無縫整合，由程式自動設定相關參數並完成精確的PDN 模擬，從而加速優化PCB 電源設計，確保電子設備的可靠性與性能。此主題將展示PyAEDT如何成為強大的助手，引領進入一個新的自動化時代。

As test requirements move to higher frequency and wider bandwidth. The RF connector and its PCB launch design are becoming increasingly important. Mating the RF connector to the test board or substrate requires careful consideration to get the full performance out of the connector. This presentation will provide an understanding of what makes a successful launch work, from design and test perspective.

Co-packaged optics is an approach that aims to address growing challenges around bandwidth density, communication latency, copper reach, and power efficiency in today’s data-hungry networks by bringing key elements needed for communication closer together — namely optics and electronics. In this presentation, we will walk you though Ansys's Multiphysics simulation solutions for developing the co-packaged optics technology.

電子相控陣天線系統普遍被應用於通訊系統，而近來由於低軌衛星的風行，讓這個技術更加受到重視，而此大型系統的設計複雜，不論是天線架構，或是系統電路都需要藉由模擬來加速開發速度，此次會針對相控陣天線系統模擬，乃至於到後續樣品的製作，進行一些簡單的介紹。

光與電 高頻高速訊號模組化模擬技術應用

CPU socket在系統中扮演極度重要的角色，其主要作用在PCB與CPU間傳遞訊號。然而訊號透過電流傳遞時會因為焦耳熱效應相對產生熱能，而熱能的產生以及散熱效率不佳容易使CPU與連接器累積熱量過高進而造成燒機失效。本研究藉由Icepak電能轉熱能的焦耳熱分析，定義兩種產品使用的情境，標準情境為穩定電流遞增，而極端情境為電流在短時間內大幅升高；透過有限元素法計算預測兩個情境下，從起始狀態達到失效溫度所需要的時間，此資訊可供IC設計者規劃對應的保護機制，避免燒機的情況發生。

科技的快速進步，包括5G、衛星網路、自動駕駛與車聯網等應用，正在為人類的發展產生巨大變革。為了實現這些應用，毫米波技術成為關鍵基礎設施，然而，毫米波頻率在傳播特性和路徑損耗方面存在獨特的挑戰。領先提供毫米波解決方案的TMYTEK，解決了5G/B5G、衛星通信和雷達系統中的挑戰，涵蓋了設計、材料、製造和測試，為FR2和FR3技術提供無縫接軌。本次將探討毫米波技術在5G、V2X通訊、衛星通訊、雷達系統的重要性，通過深入研究革命性的毫米波射頻前端設計、通訊系統、波束形成器和創新的OTA測試，TMYTEK 實現了更完整的市場應用方案。

光纖收發器發展概述/台灣雲暉科技簡介/系統佈局最佳化方法與限制/遠端近端串擾解決方案比較/最佳化方法與機構限制

小型的火箭通常使用離散式的鎖固方式將兩片整流罩結合，而在飛行過程中因整流罩需承受不同攻角造成的不對稱表面壓力，兩片整流罩會產生滑動或是縫隙。本主題主要應用最佳化方式找出關鍵參數來降低其產生的間隙達到保護酬載之目的。

因應WNC對於模組可靠度分析及封裝製程開發的需求逐漸增加，故在2024與安博科技購置Sherlock及ANSYS Mechanical，分別針對可靠度及結構的需求進行模擬。Sherlock是一套可靠度失效分析應用的軟體，搭配ANSYS Mechanical完整的靜態/動態結構模擬，可以提供RD在設計初期階段模組可靠度最弱區域，進而確認是否需要加入結構強化，亦可以在模組產品測試階段可以大幅降低測試時間。WNC在初期購置評估階段時，使用Sherlock建置實際量產機種模型及計算solder fatigue life，計算出模組最弱元件，再搭配ANSYS Mechanical模擬PCB warpage，滿足對於結構模擬的需求。

介紹如何使用SPEOS設計HUD的一次光學及二次光學，以及各種問題模擬分析，另外介紹SPEOS與ZEMAX在設計上的優勢。

本講題由富田電機講述電動載具市場上的動力馬達設計挑戰與趨勢， 並分享透過Ansys模擬軟體來評估馬達特性，滿足設計目標。

中鋼針對電動移動載具，開發自黏塗膜與高效之特殊電磁鋼片，可應用於需要高扭矩密度與高效率之移動載具。本研究利用MotorCAD分析馬達性能，並搭配鐵芯實測鐵損值與馬達實測值，利用模擬軟體修正鐵損，進而縮短模擬與實測之誤差，可縮短馬達開發時間。

因應全球車輛產業發展趨勢朝向聯網化(Connected)、自駕化(Autonomous)、服務與共享(Service & Shared)與電動化(Electric)之『CASE』四大方向發展，於電動化與智慧化之過程中，車電產品系統之使用量日益增加，故發展車電系統可靠度模擬技術，有助於車電產品業者於設計初期，即可針對組裝電路板(Printed Circuit Board Assembly, PCBA)和系統級(System Level)之可靠度進行分析確認，搭配加速試驗方法進行產品可靠度驗證，預期有助於提升產品之可靠度驗證對策效率。

智慧化是汽車產業的必然趨勢，涉及包括自動駕駛、大數據、網路安全，隨著電動化、聯網化與智駕化的發展，伴隨而來的安全議題(「Safety」和「Security」)，將是很大的挑戰，各大車廠對於汽車電子的設計規格與品質要求將日趨嚴格，各供應鏈廠商也必須遵循國際標準與車廠規範，滿足合規性。講題中，將介紹現階段車用產業在這波趨勢變動衝擊下的產業現象與因應安全標準的合規設計分享。

The planarization and integration of magnetic components, along with sharing a few practical case studies, highlight the technical and challenging aspects from an industry perspective.

對氫能及固態氧化物燃料電池( 做介紹， 並敘述 Fluent 於 SOFC 系統之應用。

近年來，隨著全球氣候變遷的加劇，各國積極發展氫能，以期降低碳排放、實現能源轉型。未來，氫能將在全球能源體系中扮演越來越重要的角色。在氫能源上游的製氫領域中，大型往覆式壓縮機(2000~20000HP)在原料壓縮及氫氣壓縮輸送扮演極為重要的角色。隨著氫能產業的發展，大型往覆式壓縮機的需求將進一步增長。預計未來，大型往覆式壓縮機在氫能產業中的應用將更加廣泛。 由於往覆式壓縮機的運動部件具有周期性往覆運動的特點，會引起周期性的交變載荷，導致曲軸產生扭轉振動，進一步造成驅動馬達結構性的嚴重破壞，透過前期有效的系統振動分析方能使設備穩定安全運行。

透過元件寬頻參數萃取、PCB 3D建模等不同模型建立方式來進行驅動器的等效電路。並透過頻譜重整的計算來實現EMI接受器的功能，來讓EMI分析可以達到定量比對的效果

在能源轉型、淨零碳排等政策推動下，具有間歇性且不易預測的再生能源特質，如何確保穩定供電成為的新課題。高壓開關設備為電力系統中重要設備之一，本文介紹運用ANSYS於SF6氣體絕緣斷路器電流啟斷性能的分析，期許在ANSYS協助下，能提供更好的解決方案，加速開發出符合台灣電力需求的新一代產品。

Abstract The numerical simulations are to be carried out in ANSYS Fluent and the computational domain comprises TTV with a heat sink mounted on a PCB submerged in a pool of dielectric fluid. A heat generation corresponding to a die heat flux of 100 W/cm2 is supplied to the TTV which is taken by the boiler configuration and boiling occurs at the heat sink surface. The simulation is first verified with the test results and are made available in examining the two-phase boiling performance in finned heat sink. A pressure outlet boundary condition is provided at the top to remove the generated vapor. The vapor pass through the condenser, which is not a part of the computational domain. The heat sink is modelled with a smooth plain surface. The dielectric fluid in the tank is provided with an initial saturated temperature and the tank boundaries are considered insulated. Detailed information regarding the simulation are elaborated in this study.